Wingtech (600745) announced yesterday evening that Nexperia Semiconductor (China) Co., Ltd., a sub-subsidiary of Wingtech, signed the Investment Agreement for the Expansion Project of Nexperia Semiconductor (China) Co., Ltd.’s Packaging and Assembly Factory with the People’s Government of Huangjiang Town, Dongguan. The total investment of this project is about RMB 3 billion.

The project invested this time is for the expansion project of the Packaging and Assembly factory of Nexperia Semiconductor (China) Co., Ltd., which is engaged in industries including but not limited to discrete devices, analog & logic ICs, and power MOSFETs.

The project will be constructed in stages according to the actual business growth needs of the company. The total investment is about RMB 3 billion, which will be invested in five years. All investments will be completed by the end of 2027. Among them, the construction of civil works is expected to start within 6 months from the date of signing the land transfer contract, which shall not exceed 12 months at the latest. It is estimated to be completed within 18 months after obtaining the construction permit and passing the acceptance of civil works.

Wingtech said that this expansion project is conducive to meeting the needs of the company’s capacity layout. The operation of this project can effectively supplement the existing semiconductor business capacity, which is conducive to improving the scale advantage of semiconductor products, and improving the long-term core competitiveness and sustainable profitability of the company.

Wingtech has been included in Apple’s 2022 supplier list. According to reports, Wingtech will undertake part of Apple’s assembly operation of Macbook Air.

Source: www.c114.com.cn